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FCBGA

Flip Chip Package is a semiconductor package that uses a micro bump on the chip pad to electrically connect the chip and the substrate, rather than using the traditional wire bonding method. Compared to existing wire bonding packages, it is a package that can be light, thin, and compact even when using chips with a higher number of I/Os. RLC noise is reduced, providing high-speed signal processing ability and better electrical performance.

Applications

Server/Network

High Performance (Computing)

Personal Computer